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Fused silica JGS2 wafer 10 x 10 mm 500 um DSP

Fused Silica wafer 500 µm

Product information "Fused silica JGS2 wafer 10 x 10 mm 500 um DSP"

Fused silica JGS2 wafer piece (10 x 10 mm), thickness = 500 ± 25 µm, 2-side polished, optical grade (40 Wafer/Box)

Material: Fused Silica
Rectangular Size: 6 - 10 mm
Surface: 2-side polished
Thickness: 401 - 500 µm