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Fused Silica JGS2 Wafer 25 x 25 mm 700 um DSP

Fused Silica wafer 700 µm

Product information "Fused Silica JGS2 Wafer 25 x 25 mm 700 um DSP"

Fused silica JGS2 wafer piece (25 x 25 mm), thickness = 700 ± 25 µm, 2-side polished

  • sales units of 50 items *
Material: Fused Silica
Rectangular Size: 21 - 50 mm
Surface: 2-side polished
Thickness: 501 - 700 µm