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FZ-Si wafer 4 inch 300 um (111) DSP

Prime FZ-Si wafer 300 µm 111

Product information "FZ-Si wafer 4 inch 300 um (111) DSP"

Prime FZ-Si wafer 4 inch, thickness = 300 ± 25 µm, (111) +/- 0.5°, 2-side polished, TTV < 10 µm, 10000 - 100000 Ohm cm (intrinsic), Bow/Warp < 30 µm