Cr etch 210 - 5.00 l - EVE/EUD!
Cr etch 210
Chromium Etchant
General Information
Cr etch 210 is an alkaline etchant for Cr. The etchant is used for the wet-chemical patterning or removal of thin Cr layers with selectivity to metals like Au, Sn, Pt, Cu, Ni, Ti, Ta. Common areas of use are for semiconductor fabrication or microsystem technology, e.g. for the removal or patterning of a Cr barrier or adhesion layer in a plating seed stack.
Product Properties
- Low undercut (in the range of the layer thickness), minimum feature size < 1µm
- Selectivity to many materials, e.g. common metals used in electroplating industry
- Available in different purity grades
- Compatible to resist mask
- Use at room temperature
- Increase of the etching rate by increased temperature up to 40°C
Selectivity
Cr etch 210 is compatible/etches selective to following materials:
- Resists: common Novolak as masking resist (e.g. AZ® Photoresist)
- Metals: no attack on Au, Sn, Pt, Cu, Ni, Ti, Ta
- Metals: attacked Cr
- Semiconductor materials: Si, SiO2, Si3N4
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Etching Rate
Under normal condition, the etching rate is around 10 to 15nm/min at 40 °C (accordingly lower at room temperature). A sputtered 30nm Cr layer is etched in about 180 seconds. The mixed etching solution is stable over time and can be used multiple times depending on the requirements of application. It is recommended to dispose the solution at the latest, when the etching rate has changed by 20%.
Further Information
MSDS:
Safety Data Sheet Cr etch 210 english
Sicherheitsdatenblatt Cr etch 210 german
TDS:
Technical Data Sheet Cr etch 210 english
Technical Data Sheet Cr etch 210 german
Application Notes:
Wet Etching english
Nasschemisches Ätzen german
Wet Etching of Metals english
Nasschemisches Ätzen von Metallen german
| Selectivity (attacked): | Cr |
|---|---|
| Selectivity (no attack on): | Au, Cu, Ni, Pt, Sn, Ta, Ti |
| Semiconductor materials: | Si, Si3N4, SiO2 |
Related products
