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CZ-Si wafer 8 inch 675 um DSP

Prime CZ-Si wafer 675 µm 100

Product information "CZ-Si wafer 8 inch 675 um DSP"

Prime CZ-Si wafer 8 inch, thickness = 675 ± 25 µm, any orientation, 2-side polished, TTV < 5 µm, any doping, 0.001 - 1000 Ohm cm