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CZ-Si wafer 8 inch 625 um DSP

Prime CZ-Si wafer 625 µm 100

Product information "CZ-Si wafer 8 inch 625 um DSP"

Prime CZ-Si wafer 8 inch, thickness = 625 ± 25 µm, any orientation, 2-side polished, TTV < 5 µm, any doping, 0.001 - 1000 Ohm cm

Diameter (round): 8 inch
Material: CZ-Si
Orientation: 100
Quality: Prime
Resistivity: 1 - 10 Ohm cm
Surface: 2-side polished
Thickness: 501 - 700 µm