Skip to main content

CZ-Si wafer 6 inch 381 um (100) DSP B-doped

Prime CZ-Si wafer 381 µm 100

Product information "CZ-Si wafer 6 inch 381 um (100) DSP B-doped"

Prime CZ-Si wafer 6 inch, thickness = 381 ± 15 µm, (100), 2-side polished, p-type (Boron), TTV < 10 µm, 1 - 10 Ohm cm

Diameter (round): 6 inch
Material: CZ-Si
Orientation: 100
Quality: Prime
Resistivity: 1 - 10 Ohm cm
Surface: 2-side polished
Thickness: 301 - 400 µm