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CZ-Si wafer 50 x 10 mm 525 um (100) SSP

Prime CZ-Si wafer 525 µm 100

Product information "CZ-Si wafer 50 x 10 mm 525 um (100) SSP"

Prime CZ-Si wafer piece (50 x 10 mm +0.0/-0.5 mm), thickness = 525 ± 25 µm, (100), 1-side polished, p-type (Boron), 1 - 20 Ohm cm, units of 50 pieces

Material: CZ-Si
Orientation: 100
Quality: Prime
Rectangular Size: 21 - 50 mm
Surface: 1-side polished
Thickness: 501 - 700 µm