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CZ-Si wafer 5 inch 600 um (100) DSP P-doped

Prime CZ-Si wafer 600 µm 100

Product information "CZ-Si wafer 5 inch 600 um (100) DSP P-doped"

Prime CZ-Si wafer 5 inch, thickness = 600 ± 15 µm, (100), 2-side polished (dsp), n-type (Phosphor) TTV < 5 µm, 1 - 10 Ohm cm, Flats: 2, Laser-marking [InvP]

Diameter (round): 5 inch
Material: CZ-Si
Orientation: 100
Quality: Prime
Resistivity: 1 - 10 Ohm cm
Surface: 2-side polished
Thickness: 501 - 700 µm