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CZ-Si wafer 4 inch 525 um (100) SSP B-doped

Prime CZ-Si wafer 525 µm 100

Product information "CZ-Si wafer 4 inch 525 um (100) SSP B-doped"

Prime CZ-Si wafer 4 inch, thickness = 525 ± 15 µm, (100), 1-side polished, p-type (Boron) TTV < 5 µm, 10 - 20 Ohm cm, Flats: 2

Diameter (round): 4 inch
Material: CZ-Si
Orientation: 100
Quality: Prime
Resistivity: 10 - 100 Ohm cm
Surface: 1-side polished
Thickness: 501 - 700 µm