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CZ-Si wafer 4 inch 380 um (100) DSP B-doped

Prime CZ-Si wafer 380 µm 100

Product information "CZ-Si wafer 4 inch 380 um (100) DSP B-doped"

Prime CZ-Si wafer 4 inch, thickness = 380 ± 15 µm, (100), 2-side polished, p-type (Boron), TTV < 5 µm, 1 - 10 Ohm cm, Bow/Warp < 30 µm, Laser-marking: B0001-xxxMSCC (xxx = 000 - 999, MS = vendor code, CC = check code), top of characters towards edge, Font SEMI OCR, height 1.0 +/- 0.025 mm, width 0.5 +/- 0.025 mm, spacing 0.875 +/- 0.025 mm, dot matrix density (W x H) 5x9, distance to edge 1.1 +/- 0.3 mm, laser mark depth < 50 µm, on front side in the middle of the long flat