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CZ-Si wafer 4 inch 300 um (100) DSP P-doped

Prime CZ-Si wafer 300 µm 100

Product information "CZ-Si wafer 4 inch 300 um (100) DSP P-doped"

Prime CZ-Si wafer 4 inch, thickness = 300 ± 25 µm, (100), 2-side polished, n-type (Phosphor), TTV < 10 µm, 0.02 - 0.05 Ohm cm

Diameter (round): 4 inch
Material: CZ-Si
Orientation: 100
Quality: Prime
Resistivity: 0.01 - 0.1 Ohm cm
Surface: 2-side polished
Thickness: 201 - 300 µm