Skip to main content

CZ-Si wafer 3 inch 775 um (100) DSP B-doped

Prime CZ-Si wafer 775 µm 100

Product information "CZ-Si wafer 3 inch 775 um (100) DSP B-doped"

Prime CZ-Si wafer 3 inch, thickness = 775 ± 25 µm, (100), 2-side polished, p-type (Boron), TTV < 10 µm, 10 - 20 Ohm cm

Diameter (round): 3 inch
Material: CZ-Si
Orientation: 100
Quality: Prime
Resistivity: 10 - 100 Ohm cm
Surface: 2-side polished
Thickness: 701 - 1000 µm