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CZ-Si wafer 3 inch 381 um (100) SSP B-doped

Test CZ-Si wafer 381 µm 100

Product information "CZ-Si wafer 3 inch 381 um (100) SSP B-doped"

Test CZ-Si wafer 3 inch, thickness = 381 ± 25 µm, (100), 1-side polished, p-type (Boron), 1 - 20 Ohm cm