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CZ-Si wafer 3 inch 360 um (100) DSP B-doped

Prime CZ-Si wafer 360 µm 100

Product information "CZ-Si wafer 3 inch 360 um (100) DSP B-doped"

Prime CZ-Si wafer 3 inch, thickness = 360 ± 25 µm, (100), 2-side polished, p-type (Boron), TTV < 10 µm, 0.001 - 0.005 Ohm cm