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CZ-Si wafer 12 inch 755 um (100) DSP

Dummy CZ-Si wafer 755 µm 100

Product information "CZ-Si wafer 12 inch 755 um (100) DSP"

Dummy CZ-Si wafer 12 inch (300 mm), thickness = 755 ± 50 µm, (100), 2-side polished, 0.001 - 10000 Ohm cm, p- and n-type mixed (> 90 % p-type), 1 notch, units of 50 wafers stacked in cakeboxes, not particle-specified, tiny scratches possible