Au etch 200 - 5.00 l
Au etch 200
Gold Etchant
General Information
Au etch 200 is a non-hazardous, cyanide-free, slightly alkaline etchant for Au. The etchant is used for the wet-chemical patterning of Au layers with selectivity to metals like Pt, Ni, Cr, Ti, Al. Common areas of use for semiconductor fabrication or micro system technology.
Product Properties
- Low undercut (in the range of the layer thickness), minimum feature size < 1 µm
- Selectivity to many materials, e.g. common metals used in electroplating industry
- Available in different purity grades
- Compatible to resist masking
- Not hazardous substance and easy to handle
Selectivity
Au etch 200 is compatible/etches selective to following materials:
- Resists: common Novolak as masking resist (e.g. AZ® Photoresist)
- Metals: no attack on Pt, Ni, Cr, Ti, Al, Ta
- Metals: attacked Au, Cu
- Semiconductor materials: Si, SiO2, Si3N4
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Etching Rate
Under normal condition, the etching rate is around 40 nm/min (at 50°C). The mixed etching solution is stable over time and can be used multiple times depending on the requirements of application. It is recommended to dispose the solution at the latest, when the etching rate has changed by 20%.
Further Information
MSDS:
Safety Data Sheet Au etch 200 english
Sicherheitsdatenblatt Au etch 200 german
TDS:
Technical Data Sheet Au etch 200 english
Technical Data Sheet Au etch 200 german
Application Notes:
Wet Etching english
Nasschemisches Ätzen german
Wet Etching of Metals english
Nasschemisches Ätzen von Metallen german
| Resist compatible: | yes |
|---|---|
| Selectivity (attacked): | Au, Cu |
| Selectivity (no attack on): | Al, Cr, Ni, Pt, Ta, Ti |
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