Au etch 200 - 5.00 l

NB Technologies GmbH

Au etch 200 is a non-hazardous, cyanide-free, slightly alkaline etchant for Au.

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1.00 l

5.00 l

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Product number: nbtaue2005

Manufacturer: NB Technologies GmbH

Product information "Au etch 200 - 5.00 l"

Au etch 200

Gold Etchant

General Information

Au etch 200 is a non-hazardous, cyanide-free, slightly alkaline etchant for Au. The etchant is used for the wet-chemical patterning of Au layers with selectivity to metals like Pt, Ni, Cr, Ti, Al. Common areas of use for semiconductor fabrication or micro system technology.

Product Properties

Low undercut (in the range of the layer thickness), minimum feature size < 1 µm
Selectivity to many materials, e.g. common metals used in electroplating industry
Available in different purity grades
Compatible to resist masking
Not hazardous substance and easy to handle

Selectivity

Au etch 200 is compatible/etches selective to following materials:

Resists: common Novolak as masking resist (e.g. AZ^® Photoresist)
Metals: no attack on Pt, Ni, Cr, Ti, Al, Ta
Metals: attacked Au, Cu
Semiconductor materials: Si, SiO2, Si3N4

Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.

Etching Rate

Under normal condition, the etching rate is around 40 nm/min (at 50°C). The mixed etching solution is stable over time and can be used multiple times depending on the requirements of application. It is recommended to dispose the solution at the latest, when the etching rate has changed by 20%.

Further Information

MSDS:
Safety Data Sheet Au etch 200 english
Sicherheitsdatenblatt Au etch 200 german

TDS:
Technical Data Sheet Au etch 200 english
Technical Data Sheet Au etch 200 german

Application Notes:
Wet Etching english
Nasschemisches Ätzen german
Wet Etching of Metals english
Nasschemisches Ätzen von Metallen german

Further Information about Processing

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