AZ TFP-650F5 (15CP) Photoresist - 3.785 l
AZ® TFP 650
Flat Panel Display Photoresist
General Information
The AZ® TFP 650 F5 resist is suitable for spin coat and extrusion coat applications excellent adhesion requirements and/or harsh etching conditions. It is designed to meet the requirements of the flat panel display industry. They are specifically optimized for a variety of applications including spin coat, extrusion coat and roller coat. These production-proven photoresists can be used with a variety of developers and removers, and they are formulated to be compatible with the underlying layers.
Product Properties
- Ultra high photospeed
- Low dark film loss
- Optimized resist adhesion
- Easy removal after hardbake
- High resistance to harsh etchants
- Compatible with all common strippers (e.g. with AZ® 100 Remover, organic solvents or aqueous alkaline)
- g-, h- and i-line sensitive (approx. 320 - 440 nm)
- Resist film thickness range approx. 1 – 2 µm
Developers
We recommend the TMAH-based AZ® 726 MIF or AZ® 326 MIF (this one contains surfactants).
Removers
For non cross-linked resist films the AZ® 100 Remover, DMSO or other common organic solvents cab be used as stripper. If the resist film is cross-linked (e.g. by high temperature steps > 140°C, during plasma processes such as dry etching, or during ion implantation), we recommend the NMP-free such as AZ® 920 Remover or TechniStrip P1316 as remover.
Thinning/ Edge Bead Removal
We recommend for thinning and edge bead removal the products AZ® EBR Solvent or PGMEA. AZ® EBR Solvent 70/30 is possible as well for edge bead removal.
Further Information
MSDS:
Safety Data Sheet AZ® TFP 650 Photoresist english
Sicherheitsdatenblatt AZ® TFP 650 Fotolack german
TDS:
Technical Data Sheet AZ® TFP 650 english
Information AZ® TFP 650 english
Application Notes:
Further Information about Photoresist Processing
| Bottle size: | 3.785 l |
|---|---|
| Chemically amplified: | no |
| Film thickness: | 1.0 – 2.0 µm |
| Film thickness range: | medium (1.6 - 5.0µm), thin (< 1.5µm) |
| High thermal stability: | no |
| Mode: | positive |
| Optimized for: | wet etching |
Related products
Developer
Remover
