AZ Remover 920 - 5.00 l
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AZ® Remover 920
Organic Solvent Based Remover
General Information
AZ® Remover 920 is designed for fast delamination and dissolution of photoresist patterns while maintaining broad compatibility with device substrates and metal films.
Merck’s proprietary solvent and additive blend is environmentally friendly and fully compliant with the European Union’s REACH regulatory code. Compatible with most AZ® positive resists (complete dissolution) and most AZ® negative resists (dissolution or delamination depending on degree of cross-linking).
Product Properties
- Flashpoint: 84.4°C
- Viscosity (20°C): 1.84 cSt
- Boiling point: 188°C
- Density (at 25°C): 1.084 g/cm3
Compatibility
- Metals: no attack on Al, Cu, Ti, W, TiW, TiN, Sn, Ni
- Substrates: Si, SiO2, GaAs
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Main Features
- Fast delamination of photoresist patterns
- Broad compatibility
- Environmentally friendly
Some Applications
- Bulk Photoresist Removal
- Metal Lift-off Lithography
- Cu Pillar Metallization Cleans
- RDL Metallization Cleans
- Delamination of Heavily Cured Photoresist Patterns & Organic Residues
Further Information
MSDS:
Safety Data Sheet AZ® Remover 920 english
Sicherheitsdatenblatt AZ® Remover 920 german
TDS:
Technical Data Sheet AZ® Remover 920 english
Application Notes:
Photoresist Removal english
Entfernen von Fotolack german
| Bottle size: | 5.00 l |
|---|---|
| Compatible Substrates: | GaAs, Si, SiO2 |
| Selectivity (no attack on): | Al, Cu, Ni, Sn, Ti, TiN, TiW, W |
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