AZ P4K-AP Coating - 3.785L
Merck Performance Materials GmbH
AZ® P4K-AP is a cost-effective coating for the protection of device surfaces during operations.
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Product number:
10P4KAP
Manufacturer:
Merck Performance Materials GmbH
Product information "AZ P4K-AP Coating - 3.785L"
AZ® P4K-AP
Protective Coating
General Information
AZ® P4K-AP is a cost-effective coating for the protection of device surfaces during operations such as back-lap or backside etch. It is based on Novolak resin and is resistant to most etchants. The thickness of this coating is 6.8 µm at 4000 rpm spin speed. Please note, that the protective coating AZ® P4K-AP is not stable in KOH-etches typically used for silicon etching.
Product Properties
AZ® P4K-AP is a blend of resin and solvent components typical of fully formulated photoresists. The AZ® P4K-AP Protective Coating excludes the photoactive component of a fully formulated photoresist, thus removing material and QA related costs for applications where photolithographic performance in unnecessary.
AZ® P4K-AP uses the same base materials as the industry standard AZ® P4620 photoresist. It offers:
- Superior adhesion to a wide variety of substrates
- Compatible with many wet chemistries, both etch and plating
- Good coating properties
- Standard photoresist coating processes are used
The AZ® P4K-AP can be used in:
- Dry etch processes
- Wet etch processes
- Plating processes
The AZ® P4K-AP is removed/stripped in standard wet or dry photoresist removal processes.
Developers
AZ® P4K-AP is not a photoresist, therefore there is no developer required.
Removers
AZ® P4K-AP can be removed with all common photoresist strippers such as: Acetone, alkaline solutions, AZ® 100 Remover, DMSO, AZ® 920 Remover and TechniStrip P1316.
Thinning/ Edge Bead Removal
We recommend for thinning and edge bead removal PGMEA and AZ® EBR Solvent.
Further Information
MSDS:
Safety Data Sheet AZ® P4K-AP Photoresist english
Sicherheitsdatenblatt AZ® P4K-AP Fotolack german
TDS:
Technical Data Sheet AZ® P4K-AP Photoresist english
Application Notes:
Further Information about Photoresist Processing
Remover
Acetone MC - 2.50 l - ULSI - EUD/EVE!
MACU1025
Manufacturer:
MicroChemicals GmbH
|
Bottle size:
2.50 l
|
Purity:
ULSI
Acetone
CH3COCH3
General Information
Acetone removes organic impurities from substrates and is well suited for greasy/oily contaminations. However, its large vapour pressure causes rapid drying together with a resorption of the contaminants on the substrate. Therefore an immediately subse¬quent rinsing step is recommended with a higher boiling solvent such as isopropanol.
Acetone is not well-suited as lift-off medium due to the high fire danger when heated and the trend of particles to be lifted to resorb onto the substrate.
Product Properties
Density: 0.79 g/cm^3
Melting point: 95°C
Boiling point: 56°C
Flash point: < -18°C
Vapour pressure @ 20°C: 244 hPa
Acetone Molecule
Further Information
MSDS:
Safety Data Sheet Acetone english (TECHNIC France)
Sicherheitsdatenblatt Aceton german (TECHNIC France)
Safety Data Sheet Acetone english (MicroChemicals GmbH)
Sicherheitsdatenblatt Aceton german (MicroChemicals GmbH)
Specs:
Specs Acetone ULSI (TECHNIC France)
Specs Acetone VLSI (TECHNIC France)
Specs Acetone ULSI (MicroChemicals GmbH)
Application Notes:
Solvents english
Lösemittel german
Acetone MC - 5.00 l - ULSI - EUD/EVE!
MACU1050
Manufacturer:
MicroChemicals GmbH
|
Bottle size:
5.00 l
|
Purity:
ULSI
Acetone
CH3COCH3
General Information
Acetone removes organic impurities from substrates and is well suited for greasy/oily contaminations. However, its large vapour pressure causes rapid drying together with a resorption of the contaminants on the substrate. Therefore an immediately subse¬quent rinsing step is recommended with a higher boiling solvent such as isopropanol.
Acetone is not well-suited as lift-off medium due to the high fire danger when heated and the trend of particles to be lifted to resorb onto the substrate.
Product Properties
Density: 0.79 g/cm^3
Melting point: 95°C
Boiling point: 56°C
Flash point: < -18°C
Vapour pressure @ 20°C: 244 hPa
Acetone Molecule
Further Information
MSDS:
Safety Data Sheet Acetone english (TECHNIC France)
Sicherheitsdatenblatt Aceton german (TECHNIC France)
Safety Data Sheet Acetone english (MicroChemicals GmbH)
Sicherheitsdatenblatt Aceton german (MicroChemicals GmbH)
Specs:
Specs Acetone ULSI (TECHNIC France)
Specs Acetone VLSI (TECHNIC France)
Specs Acetone ULSI (MicroChemicals GmbH)
Application Notes:
Solvents english
Lösemittel german
AZ 100 Remover - 5.00 l
1000100
AZ® 100 Remover
Universal Photoresist Stripper
General Information
AZ®100 Remover is based on solvent and amine (alkaline). AZ®100 Remover is used for photoresist stripping with low attack to aluminium. Low hazard is achieved by the use of ethanol amine.
Low evaporation rate allows the use at elevated temperatures (up to 80°C), high efficiency (>3000 wafer per litre) helps saving costs. Where attack to aluminium is of no concern, it may even be diluted with water.
AZ®100 Remover is not compatible with AZ® nLof 2070 (AZ® nLof 2000 series) resists and other heavily cross linked resists.
Product Properties
Density (at 25°C): 0.955 kg/l
Color (Alpha): max. 20
Flashpoint (AP): 72°C
Normality (potentiometric): 3.1 mol/l
Boiling range: 159-194°C
Further Information
MSDS:
Safety Data Sheet AZ® 100 Remover english
Sicherheitsdatenblatt AZ® 100 Remover german
TDS:
Technical Data Sheet AZ® 100 Remover english
Application Notes:
Photoresist removal english
Fotolack entfernen german
DMSO - 2.50 l - ULSI
MDMU1025
DMSO
Dimethyl Sulfoxide
General Information
Due to its low vapour pressure and its water solubility, DMSO is an excellent stripper for resists respectively Lift-off media and is a non-toxic substitute for the NMP, which has been classified as toxic since a while. The optional addition of Cyclopentanone or MEK increases the performance of the stripper for certain applications and significantly lowers the melting point of pure DMSO.
NOTE:
The solvent DMSO (dimethyl sulfoxide) has a melting point just below room temperature, so it can possi¬bly freeze in storage in cooler rooms. Thawing may require several days, but afterwards the product can still be used as it is.
For more details please download the info letter.
Product Properties
Density: 1.1 g/cm3
Melting point: 18°C
Boiling point: 189°C
Flash point: 87°C
Vapour pressure @ 20°C: 0.56 hPa
DMSO Molecule
Further Information
MSDS:
Safety Data Sheet DMSO (ULSI) english
Sicherheitsdatenblatt DMSO (ULSI) german
Specs:
Specs DMSO (ULSI)
Application Notes:
Solvents: Theory and Application english
Lösemittel: Theorie und Anwendung german
Photoresist Removal english
Fotolack entfernen german
Further Information about Processing
TechniStrip P1316 - 5.00 l - MOS
TP1316M5
TechniStrip® P1316
High Performance Remover
General Information
TechniStrip® P1316 is a remover with very strong stripping power for Novolak-based resists (including all AZ® positive resists), epoxy-based coatings, polyimides and dry films. At a typical application temperatures around 75°C TechniStrip® P1316 may dissolve cross-linked resists without residue also, e.g. through dry etching or ion implantation. The remover can also be used in spraying processes.
Product Properties
Flashpoint: 93°C
Viscosity (20°C): < 2 cP
Water Solubility: Totally miscible
Boiling point: 189°C
Density (at 20°C): 1.03 g/cm3
Compatibility
Metals: attacked Al, Cu, Au
Metals: no attack on Ta, Ni, Ti, TiN
Substrates: Si, SiO2
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Some Applications
TechniStrip® P1316 is a powerful NMP-free remover for:
Novolak-based positive resists such as all positive AZ® resists
Epoxy-based resists
Polyimides, bonding glues
Dry films
Further Information
MSDS:
Safety Data Sheet TechniStrip P1316 (MOS) english
Sicherheitsdatenblatt TechniStrip P1316 (MOS) german
TDS:
Technical Data Sheet TechniStrip P1316 (MOS) english
Specs:
Specs TechniStrip P1316 (MOS)
Application Notes:
Photoresist Removal english
Fotolack entfernen german
Further Information about Processing
AZ Remover 920 - 5.00 l
1000920
AZ® Remover 920
Organic Solvent Based Remover
General Information
AZ® Remover 920 is designed for fast delamination and dissolution of photoresist patterns while maintaining broad compatibility with device substrates and metal films.
Merck’s proprietary solvent and additive blend is environmentally friendly and fully compliant with the European Union’s REACH regulatory code. Compatible with most AZ® positive resists (complete dissolution) and most AZ® negative resists (dissolution or delamination depending on degree of cross-linking).
Product Properties
Flashpoint: 84.4°C
Viscosity (20°C): 1.84 cSt
Boiling point: 188°C
Density (at 25°C): 1.084 g/cm3
Compatibility
Metals: no attack on Al, Cu, Ti, W, TiW, TiN, Sn, Ni
Substrates: Si, SiO2, GaAs
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Main Features
Fast delamination of photoresist patterns
Broad compatibility
Environmentally friendly
Some Applications
Bulk Photoresist Removal
Metal Lift-off Lithography
Cu Pillar Metallization Cleans
RDL Metallization Cleans
Delamination of Heavily Cured Photoresist Patterns & Organic Residues
Further Information
MSDS:
Safety Data Sheet AZ® Remover 920 english
Sicherheitsdatenblatt AZ® Remover 920 german
TDS:
Technical Data Sheet AZ® Remover 920 english
Application Notes:
Photoresist Removal english
Entfernen von Fotolack german