Merck Performance Materials GmbH

AZ P4903 Photoresist - 3.785 l

AZ® P4620 is a DNQ based resist for high film thicknesses and for wet etching applications.
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Product number: 1A0P4903
Manufacturer: Merck Performance Materials GmbH
Product information "AZ P4903 Photoresist - 3.785 l"

AZ® P4903

Positive Thick Resist - AZ® P4110, AZ® P4330, AZ® P4903, AZ® P4620

 

General Information

The AZ® P4000 positive resist series with its members AZ® P4110, AZ® P4330, AZ® P4620 and AZ® P4903 have two main characteristics: An improved adhesion to all common substrates for a higher stability for e.g. wet etching or plating and a lower photo active compound concentration, which allows the application of thick and very thick resist films (approx. 1 - 30 µm). This resist series have a medium thermal stability and can be developed with common KOH or TMAH based developers.

Product Properties
  • Optimized resist adhesion to all common substrate materials
  • Broad process parameter window for stable and reproducible litho-processes
  • Compatible with all common developers (KOH- or TMAH-based)
  • Compatible with all common strippers (e.g. with AZ® 100 Remover, organic solvents or aqueous alkaline)
  • g-, h- and i-line sensitive (approx. 320 - 440 nm)
  • Resist film thickness range approx. 10 - 35 µm
Developers

If metal ion containing developers can be used the KOH-based AZ® 400K in a 1:4 dilution or the finish diluted version AZ® 400K 1:4 (for higher resist film thicknesses 1:3.5 - 1:3 diluted possible) is a suited developer. If metal ion free developers have to be used, we recommend the TMAH-based AZ® 2026 MIF developer (undiluted).

Removers

For non cross-linked resist films the AZ® 100 Remover, DMSO or other common organic solvents can be used as stripper. If the resist film is cross-linked (e.g. by high temperature steps > 140°C, during plasma processes, such as dry etching, or during ion implantation), we recommend the NMP-free TechniStrip P1316 as remover. AZ® 920 Remover can be a good choice as well in case of harsh treated or hard to remove resist residuals.

Thinning/ Edge Bead Removal

We recommend for thinning and edge bead removal AZ® EBR Solvent or PGMEA. AZ® EBR70/30 Solvent is possible as well for edge bead removal.

Further Information

MSDS:
Safety Data Sheet AZ® P4903 Photoresist english
Sicherheitsdatenblatt AZ® P4903 Fotolack german

TDS:
Technical Data Sheet AZ® P4000 Series english
Information AZ® P400 Series english

Application Notes:
Further Information about Photoresist Processing

Bottle size: 3.785 l
Chemically amplified: no
Film thickness: 10.0 – 35.0 µm
Film thickness range: thick (> 5.1µm)
High thermal stability: no
Mode: positive
Optimized for: electroplating, wet etching