AZ LNR-003 diluted - 1:0.3 with PGMEA - 1.00 l
AZ® LNR-003 diluted - 1:0.3 with PGMEA
Negative Resist for Lift-off Applications
General Information
AZ® LNR-003 is a negative resist for film thicknesses of approx. 3 - 5 µm (diluted down to 1 µm), which allows an adjustable and strong undercut (negative resist profile) even at small resist film thicknesses for also ambitious lift-off applications. Its high thermal stability prohibits thermal reflow during coating for reproducible lift-off results.
Product Properties
- High resolution
- Very strong undercut, for lift-off
- Compatible with TMAH-based developers, other developers are possible
- Compatible with all common strippers (e. g. with AZ® 100 Remover, organic solvents, or aqueous alkaline)
- i-line sensitive (approx. 320 - 390 nm)
- Resist film thickness range approx. 3 - 5 µm
- High thermal stability
Developers
We recommend the TMAH-based developers AZ® 2026 MIF, AZ® 326 MIF or AZ® 726 MIF. Other NaOH- or KOH-based developers are generally possible.
Removers
We recommend the NMP-free removers such as AZ® 910 Remover or TechniStrip NI555 or, in case of alkaline sensitive materials such as aluminium, TechniStrip MLO07, which both can dissolve also crosslinked resist films.
Thinning/ Edge Bead Removal
We recommend for thinning and edge bead removal the AZ® EBR Solvent.
Further Information
MSDS:
Safety Data Sheet AZ® LNR-003 Photoresist english
Sicherheitsdatenblatt AZ® LNR-003 Fotolack german
TDS:
Technical Data Sheet AZ® LNR-003 english
Information AZ® LNR-003 english
Application Notes:
Further Information about Photoresist Processing
| Chemically amplified: | yes |
|---|---|
| Film thickness: | 3 - 5 µm |
| Film thickness range: | medium (1.6 - 5.0µm) |
| High thermal stability: | yes |
| Mode: | negative |
| Optimized for: | lift-off |
Related products
Developer
Remover
