AZ IPS-6090 Photoresist - 3.785 l
Available in 28 days, delivery time 3-4 Tage
AZ® IPS-6090
Positive Thick Resist
General Information
AZ® IPS-6090 for 30 - 150 µm Resist Film Thickness (i-line) The chemically amplified AZ® IPS-6090 is, comparable to the AZ® 40XT, an ultra thick resist whose high viscosity allows very large resist film thicknesses via a single coating. It does not require rehydration, requires low light doses, releases no nitrogen during exposure, and develops very rapidly, thus permitting significantly shorter process times compared to standard thick resist films. However, the AZ® IPS-6090 necessarily requires a post exposure bake to be developed. It has been developed for use as patterning in semiconductors advanced packaging application (3DIC/TSV, CU Pillar, WLCSP, MEMS).
IPS 6050 (80 µm resist film thickness)
Product Properties
- Very high resolution
- High aspect ratio
- Low exposure dose for the thickness of the film
- Straight pattern profile and footing free
- i-line sensitive, 330 – 390 nm
- Film thickness range: 30 - 150 µm
- Suited for applications such as electro chemical deposition / plating of Cu RDL in WLCSP process
- Electro chemical deposition / plating of Cu, Ni, Sn, SnAg, Au for 3DIC, FO and Flipchip processing
- Sacrificial layer for Si etching process in TSV
- Sacrificial layer for SiO2 or SiN etching process in CMOS sensor processing
Developers
We recommend AZ® 326 MIF Developer or AZ® 726 MIF Developer (this one contains surfactants) for the photoresist AZ® IPS-6090.
Removers
For non cross-linked resist films the AZ® 100 Remover, DMSO or other common organic solvents can be used as stripper. If the resist film is cross-linked (e.g. by high temperature steps > 140°C, during plasma processes, such as dry etching, or during ion implantation), we recommend the NMP-free TechniStrip P1316 as remover or the TechniStrip P1331.
Thinning/ Edge Bead Removal
We recommend for thinning and edge bead removal AZ® EBR Solvent or PGMEA. AZ® EBR70/30 Solvent is possible as well for edge bead removal.
Further Information
MSDS:
Safety Data Sheet AZ® IPS-6090 Photoresist english
Sicherheitsdatenblatt AZ® IPS-6090 Fotolack german
TDS:
Technical Data Sheet AZ® IPS-6090 english
Information AZ® IPS-6090 english
Application Notes:
Further Information about Photoresist Processing
| Chemically amplified: | yes |
|---|---|
| Film thickness: | 30.0 – 150.0 µm |
| Film thickness range: | thick (> 5.1µm) |
| High thermal stability: | no |
| Mode: | positive |
| Optimized for: | electroplating |
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Developer
Remover
