Merck Performance Materials GmbH

AZ 4999 Photoresist - 3.785 l - EUD/EVE!

AZ® 4999 is an image reversal resist for spray coating applications.

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3.785 l

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Product number: 1A004999

Manufacturer: Merck Performance Materials GmbH

Product information "AZ 4999 Photoresist - 3.785 l - EUD/EVE!"

AZ^® 4999

Spray Coating

General Information

AZ^®4999 is a spray coating dedicated highly transparent photoresist tailored to excel on special spray coating equipment (e.g. SUSS Delta AltaSpray) where it provides defect free and conformal coatings on devices with severe topography. Thick (several to several tens of microns) and uniform resist coatings are obtained on topography such as V-grooves and trenches with optimum coverage of sharp edges. There is no accumulation of resist in trenches. The use of AZ^®4999 photoresist enables high reproducibility in volume production applications.

Product Properties

Viscosity (at 25°C): 0.52 cSt
Solids content: 4 %
Absorptivity at 398 nm: 0.1 l/(g*cm) Spectral sensitivity: 310 nm – 440 nm

Developers

If metal ion containing developers can be used, the KOH-based AZ^® 400K in a 1:4 dilution (for higher resist film thicknesses 1:3.5 - 1:3 diluted possible) is a suited developer.
If metal ion free developers have to be used, we recommend the TMAH-based AZ^® 2026 MIF developer (undiluted).

Removers

For non cross-linked resist films the AZ^® 100 Remover, DMSO or other common organic solvents cab be used as stripper. If the resist film is crosslinked (e. g. by high temperature steps > 140°C, during plasma processes such as dry etching, or during ion implantation), we recommend the NMP-free TechniStrip P1316 as remover. AZ^® 920 Remover can be a good choice as well, in case of harsh treated, hard to remove resist residuals.

Thinning/ Edge Bead Removal

We recommend for thinning and edge bead removal the products AZ^® EBR Solvent or PGMEA.

Further Information

MSDS:
Safety Data Sheet AZ^® 4999 Photoresist english
Sicherheitsdatenblatt AZ^® 4999 Fotolack german

TDS:
Technical Data Sheet AZ^® 4999 Photoresist english

Application Notes:
Further Information about Photoresist Processing

Chemically amplified:	no
Film thickness:	1 – 20 µm
Film thickness range:	medium (1.6 - 5.0µm), thick (> 5.1µm), thin (< 1.5µm)
High thermal stability:	no
Mode:	positive
Optimized for:	dry etching, spray coating, wet etching

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