AZ 4533 Photoresist - 3.785 l
AZ® 4533
Thick Resists with Optimized Adhesion
General Information
The AZ® 4500 series (AZ® 4533 and AZ® 4562) are positive thick resists with optimized adhesion for common wet etching and plating processes. The AZ® 4500 series follows the AZ® 1500 series in the attainable and processable resist film thickness range. AZ® 4533 (3.3 µm resist film thickness at 4000 rpm) and AZ® 4562 (6.2 µm) have a lower photoinitiator con¬centration compared to thin resists. This makes it possible to process thick resist films over 10 µm without N2 bubble formation, but at the expense of a significantly lower development rate.
Product Properties
- Optimized resist adhesion to all common substrate materials
- Broad process parameter window for stable and reproducible litho-processes
- Compatible with all common developers (KOH- or TMAH-based)
- Compatible with all common strippers (e.g. with AZ® 100 Remover, organic solvents, or aqueous alkaline)
- g-, h- and i-line sensitive (approx. 320 - 440 nm)
- Resist film thickness range approx. 2.5 - 5 µm
Developers
If metal ion containing developers can be used the KOH-based AZ® 400K in a 1:4 dilution or the finish diluted version AZ® 400K 1:4 (for higher resist film thicknesses 1:3.5 - 1:3 diluted possible) is a suited developer. If metal ion free developers have to be used, we recommend the TMAH-based AZ® 2026 MIF developer (undiluted).
Removers
For non cross-linked resist films the AZ® 100 Remover, DMSO or other common organic solvents can be used as stripper. If the resist film is cross-linked (e.g. by high temperature steps > 140°C, during plasma processes such as dry etching, or during ion implantation), we recommend the NMP-free TechniStrip P1316 as remover. AZ® 920 Remover can be a good choice as well, in case of harsh treated, hard to remove resist residuals.
Further Information
MSDS:
Safety Data Sheet AZ® 4533 Photoresist english
Sicherheitsdatenblatt AZ® 4533 Fotolack german
TDS:
Technical Data Sheet AZ® 4533 Photoresist english
Application Notes:
Further Information about Photoresist Processing
| Chemically amplified: | no |
|---|---|
| Film thickness: | 2.5 – 5.0 µm |
| Film thickness range: | medium (1.6 - 5.0µm) |
| High thermal stability: | no |
| Mode: | positive |
| Optimized for: | electroplating, wet etching |
Related products
Developer
Remover
