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Merck Performance Materials GmbH

AZ 40XT-11D Photoresist - 3.785 l

AZ® 40XT is an ultra thick chemically amplified positive resist for plating applications.

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3.785 l

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Product number: 10040XT

Manufacturer: Merck Performance Materials GmbH

Product information "AZ 40XT-11D Photoresist - 3.785 l"

AZ^® 40XT

Chemically Amplified Thick Photoresist

General Information

AZ^® 40XT for 15 - 100 µm Resist Film Thickness (i-line) The chemically amplified AZ^® 40 XT is an ultra thick resist whose high viscosity allows very large resist film thicknesses via a single coating. It does not require rehydration, requires low light doses, releases no nitrogen during exposure and develops very rapidly, thus permitting significantly shorter process times compared to standard thick resist films. However, the AZ^® 40XT necessarily requires a Post Exposure Bake to be developed. Remark: The maximum soft bake temperature must not be applied abruptly, in order to prevent the formation of bubbles in the resist film. We recommend either the usage of a proximity hotplate, or a temperature ramp on a contact hotplate. The correct temperature ramps are crucial for bubble free resist processing with this resist.

Lines and spaces varying from 100 to 10 µm with a 40 µm thick AZ<sup>®</sup> 40XT at 400 mJ/cm2 exposure dose

Lines and spaces varying from 100 to 10 µm with a 40 µm thick AZ^® 40XT at 400 mJ/cm2 exposure dose

Product Properties

15 - 100 µm resist film thickness via single-coating
Aqueous alkaline developers (e.g. AZ^® 326/726/2026 MIF)
No rehydration required, no N2-formation during exposure
Very good adhesion, very steep resist sidewalls
Can be stripped wet- and dry-chemically
Optimized for electroplating, wet- and dry etching
i-line sensitive (approx. 330 – 390 nm)

Developers

We recommend common TMAH-based developers such as the AZ^® 326 MIF, AZ^® 726 MIF or AZ^® 2026 MIF developer.

Removers

AZ^® 40XT photoresist is compatible with industry standard solvent based removers (e.g. NMP, DMSO, AZ^® 920 Remover or Technistrip MLO07).

Thinning/ Edge Bead Removal

We recommend for thinning and edge bead removal AZ^® EBR Solvent or PGMEA. AZ^® EBR70/30 Solvent is possible as well for edge bead removal.

Further Information

MSDS:
Safety Data Sheet AZ^® 40XT Photoresist english
Sicherheitsdatenblatt AZ^® 40XT Fotolack german

TDS:
Technical Data Sheet AZ^® 40XT Photoresist english

Application Notes:
Further Information about Photoresist Processing

Chemically amplified:	yes
Film thickness:	15.0 – 100.0 µm
Film thickness range:	thick (> 5.1µm)
High thermal stability:	no
Mode:	positive
Optimized for:	electroplating

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