AZ 2026 MIF Developer - 5.00 l

Merck Performance Materials GmbH

AZ® 2026 MIF Developer is a developer formulation with 2.38 % TMAH (tetramethylammoniumhydroxide) in H2O.

The prices are visible after registration.

Price available after login.

Send us an inquiry if you have any questions about articles, purchase quantities, delivery times or sample requests!

Product enquiry / price on request

Product number: 1002026

Manufacturer: Merck Performance Materials GmbH

Product information "AZ 2026 MIF Developer - 5.00 l"

AZ^® 2026 MIF Developer

Metal Ion-free Developers

General Information

AZ^® 2026 MIF is a TMAH-based developer for dip or puddle development, compatible with all AZ^® photoresists from our portfolio.

Product Properties

The ready-to-use AZ^® 2026 MIF developer is an aqueous 2.38% TMAH solution with a surfactant for uniform substrate wetting for puddle development, but is also suitable for immersion development. In addition, the AZ^® 2026 MIF contains an additive to promote residue-free development with cross-linked resist structures. Since this additive slightly increases the dark erosion in positive resists, the AZ^® 2026 MIF is less suitable for these resists, especially when high resolution requirements are required; in this case, the AZ^® 326 MIF or AZ^® 726 MIF would be the better choice. TMAH-based developers are always used when development has to be carried out metal ion free. In addition, TMAH-based developers are primarily recommended for our chemically amplified positive resists and our negative resists. For standard (non chemically amplified), DNQ-based positive resists without the requirement of metal ion-free development, a KOH or NaOH-based developer such as AZ^® 400K or AZ^® 351B can be considered instead of a TMAH-based developer for cost reasons. For very thin resist layers (< 1 µm) or very high resolution requirements, it can be useful to dilute AZ^® 2026 MIF with water (AZ® 2026 MIF: water = 2:1 to a maximum of 1:1). AZ^® 2026 MIF attacks aluminum with an etching rate of approx. 70 nm/min. If this cannot be tolerated, the Al-compatible "AZ^® Developer " is an alternative, but this is based on sodium compounds and is therefore not metal ion-free.

Further Information

Our safety data sheets and some of our technical data sheets are password-protected.
You will receive the access data after completing the form.
The access data for the data sheets are not your login data from our shop!

MSDS:
Safety Data Sheet AZ^® 2026 MIF Developer english
Safety Data Sheet AZ^® 2026 MIF Developer german

TDS:
Technical Data Sheet AZ^® 2026 MIF Developer english

Application Notes:
Further Information about development of photoreist english
Further Information about development of photoresist german

Related products

Details

AZ 2033 MIF Developer - 5.00 l

1002033

AZ® 2033 MIF Developer Metal Ion-free Developers General Information AZ® 300 MIF, AZ® 326 MIF, AZ® 726 MIF and AZ® 2026 MIF Developers are developer formulations with 2.38 % TMAH (tetramethylammoniumhydroxide) in H2O. The AZ® 726 MIF Developer contains additionally a surfactant for better wetting and easy to settle up of puddle development. Additionally to the wetting agent of the AZ® 726 MIF the AZ® 2026 MIF contains a scum remover for complete and scum-free removal of resist layers on the price of a slightly higher dark erosion ratio. However, for our negative resists, such as AZ® nLof 2000 series, AZ® 15nXT series, AZ® 125nXT resists this developer shows outstanding performance. Even for a positive resist like AZ® 10XT resist it significantly reduces t-topping if this problem occurs. AZ® 2033 MIF is 3.00 % TMAH in H2O with surfactants added for fast and homogeneous substrate wetting and further additives for removal of resist residuals (residues in certain lacquer families), but at the cost of a higher dark removal. Compared to the AZ® 2026 MIF, the normality is not 0.26 but 0.33. Thus the development rate is higher with the AZ® 2033 MIF Developer. Further Information MSDS: Safety Data Sheet AZ® 2033 MIF Developer english Sicherheitsdatenblatt AZ® 2033 MIF Entwickler german TDS: Technical Data Sheet AZ® 2033 MIF Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

Details

AZ 326 MIF Developer - 5.00 l

1000326

AZ® 326 MIF Developer Metal Ion-free Developer General Information AZ® 326 MIF is a TMAH-based developer for dip or spray development, compatible with all AZ®</sup photoresists from our portfolio. Product Features The ready-to-use AZ® 326 MIF developer is an aqueous 2.38% TMAH solution without any additives. This makes it suitable for dip or spray development, but less for puddle development, for which the AZ® 726 MIF developer is the better choice due to its special surfactant for substrate wetting. TMAH-based developers are always used when development must be carried out metal ion free. In addition, TMAH- based developers are primarily recommended for our chemically amplified positive resists and our negative resists. For very thin resist layers (< 1 µm) or very high resolution requirements, it can be useful to dilute the AZ® 326 MIF with water (AZ® 326 MIF : water = 2:1 to a maximum of 1:1). AZ® 326 MIF attacks aluminum with an etching rate of approx. 70 nm/min. If this cannot be tolerated, the Al-compatible AZ® Developer is an alternative, which, however, is based on sodium compounds and is therefore not metal ion-free. For standard (non chemically amplified), DNQ-based positive resists without the requirement of metal ion-free development, a KOH- or NaOH-based developer such as AZ® 400K or AZ® 351B can be considered instead of a TMAH-based developer for cost reasons. For cross-linking negative resists, AZ® 2026 MIF can prove advantageous, which promotes residue-free development with these resists through certain additives. Further Information Our safety data sheets and some of our technical data sheets are password-protected. You will receive the access data after completing the form. The access data for the data sheets are not your login data from our shop! MSDS: Safety Data Sheet AZ® 326 MIF Developer english Safety Data Sheet AZ® 326 MIF Entwickler german TDS: Technical Data Sheet AZ® 326 MIF Developer english Application Notes: Development of Photoresist english Development of Photoresist german

Details

AZ 726 MIF Developer - 5.00 l

1000726

AZ® 726 MIF Developer Metal Ion-free Developers General Information AZ® 726 MIF is a TMAH-based developer for dip or puddle development, compatible with all AZ® photoresists from our portfolio. Product Features The ready-to-use AZ® 726 MIF Developer is an aqueous 2.38% TMAH solution with a surfactant for even substrate wetting for puddle development, but is also suitable for immersion development. For spray development, the surfactant-free AZ® 326 MIF would be the better choice to avoid foaming. TMAH-based developers are always used when metal ion-free development is required. In addition, TMAH-based developers are primarily recommended for our chemically amplified positive resists and our negative resists. For standard (non chemically amplified), DNQ-based positive resists without the requirement for metal ion-free development, a KOH or NaOH-based developer such as AZ® 400K or AZ® 351B can be considered instead of a TMAH-based developer for cost reasons. For cross-linking negative resists, the AZ® 2026 MIF can prove to be advantageous, as it promotes residue-free development with these resists thanks to certain additives. For very thin resist layers (< 1 µm) or very high resolution requirements, it can be useful to dilute the AZ® 726 MIF Developer with water (AZ® 726 MIF: water = 2:1 to a maximum of 1:1). AZ® 726 MIF attacks aluminum with an etching rate of approx. 70 nm/min. If this cannot be tolerated, the Al-compatible AZ® Developer is an alternative, but this is based on sodium compounds and is therefore not free of metal ions. Further Information Our safety data sheets and some of our technical data sheets are password-protected. You will receive the access data after completing the form. The access data for the data sheets are not your login data from our shop! MSDS: Safety Data Sheet AZ® 726 MIF Developer english Safety Data Sheet AZ® 726 MIF Entwickler german TDS: Technical Data Sheet AZ® 726 MIF Developer english Application Notes: Development of Photoresist english Development of Photoresist german

Details

AZ 300 MIF Developer - 5.00 l

1000300

AZ® 300 MIF Developer Metal Ion-free Developers General Information AZ® 300 MIF, AZ® 326 MIF, AZ® 726 MIF and AZ® 2026 MIF Developers are developer formulations with 2.38 % TMAH (tetramethylammoniumhydroxide) in H2O. The AZ® 726 MIF Developer contains additionally a surfactant for better wetting and easy to settle up of puddle development. Additionally to the wetting agent of the AZ® 726 MIF the AZ® 2026 MIF contains a scum remover for complete and scum-free removal of resist layers on the price of a slightly higher dark erosion ratio. However, for our negative resists, such as AZ® nLof 2000 series, AZ® 15nXT series, AZ® 125nXT resists this developer shows outstanding performance. Even for a positive resist like AZ® 10XT resist it significantly reduces t-topping if this problem occurs. AZ® 2033 MIF is 3.00 % TMAH in H2O with surfactants added for fast and homogeneous substrate wetting and further additives for removal of resist residuals (residues in certain lacquer families), but at the cost of a higher dark removal. Compared to the AZ® 2026 MIF, the normality is not 0.26 but 0.33. Thus the development rate is higher with the AZ® 2033 MIF Developer. Further Information MSDS: Safety Data Sheet AZ® 300 MIF Developer english Sicherheitsdatenblatt AZ® 300 MIF Entwickler german TDS: Technical Data Sheet AZ® 300 MIF Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german