AZ 15nXT Photoresist (115cps) - 3.785 l
Available in 21 days, delivery time 3-4 Tage
AZ® 15nXT (115CPS)
Thick Negative Resist for Plating
General Information
AZ® 15nXT (115CPS) for 3 - 6 µm Resist Film Thickness (i-line)
The AZ® 15nXT (115CPS) is a negative resist for film thicknesses up to approx. 6 µm, with a resist film thickness of 3.5 µm at 4000 rpm. Its cross-linking character and its very good resist adhesion make it stable, for example, for all conventional electroplating applications. Up to about 6 µm resist film thickness, the resist sidewalls are vertical, with larger film thicknesses, increasingly negative (undercut) so that the moulded metal structures taper towards the top. A post exposure bake is obligatory to carry out the cross-linking initiated during exposure.
5 µm lines at 10 µm resist film thickness.
5 µm holes at 10 µm resist film thickness.
5 µm plated CuNi image.
3.6 µm plated CuNi image.
Product Properties
- 3 - 6 µm resist film thickness via single-coating
- Aqueous alkaline developers, preferably AZ® 2026 MIF
- Excellent adhesion, no underplating
- Wide substrate compatibility: Cu, Au, Ti, NiFe, …
- Wide plating compatibility: Cu, Ni, Au, …
- Standard wet stripping processes
- Almost vertical sidewall angles
Developers
We recommend the TMAH-based, ready-to-use AZ® 2026 MIF Developer. AZ® 326 MIF and AZ® 726 MIF are possible as well.
Removers
The recommended stripper for the AZ® 15nXT is the NMP-free, nontoxic TechniStrip NI555 or the AZ® 910 Remover, which is compatible with all common (even alkaline sensitive) substrate materials and can even dissolve (not only peel from the substrate) cross linked AZ® 15nXT resist films. Solvents such as NMP or the nontoxic substitute DMSO are suited removers, if the resist film thickness and degree of crosslinking are not too high. Generally, heating these removers up to 60 - 80°C, or/and ultrasonic treatment, might be required to fasten the resist removal in the case of very thick or strongly crosslinked resist films.
Thinning/ Edge Bead Removal
We recommend for thinning and edge bead removal the products AZ® EBR Solvent or PGMEA.
Further Information
MSDS:
Safety Data Sheet AZ® 15nXT (115CPS) Photoresist english
Sicherheitsdatenblatt AZ® 15nXT (115CPS) Fotolack german
TDS:
Technical Data Sheet AZ® 15nXT (115CPS) Photoresist english
Technical Data Sheet AZ® 15nXT Series english
Application Notes:
Further Information about Photoresist Processing
| Chemically amplified: | yes |
|---|---|
| Film thickness: | 3 - 6 µm |
| Film thickness range: | medium (1.6 - 5.0µm), thick (> 5.1µm) |
| High thermal stability: | yes |
| Mode: | negative |
| Optimized for: | dry etching, electroplating |
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Developer
Remover
