AZ 125nXT-10B Photoresist - 3.785 l
AZ® 125nXT-10B
Ultra-Thick Negative Resist for Plating
General Information
AZ® 125nXT-10B for 25 - 200 µm Resist Film Thickness (i-line) The AZ® 125nXT-10B is a negative resist for film thicknesses up to over 100 µm with at the same time very high sidewall steepness. And even more (1 mm resist film thickness realized!) with very steep sidewalls and special coating techniques It’s cross-linking and very good resist adhesion make it stable in all conventional electroplating applications. This resist does not require a post exposure bake.
20 µm lines at 60 µm resist film thickness.
15 µm holes at 60 µm resist film thickness.
80 µm plated CuNi image.
Product Properties
- 30 – 100 µm resist film thickness via single-coating
- Up to 1 mm resist film thickness possible
- Aqueous alkaline developers (e. g. AZ® 326/726/2026 MIF)
- No post exposure bake, photo-polymerization during exposure
- No rehydration required, no N2-formation during exposure
- Very good adhesion, no underplating
- Wet stripping processes (e. g. TechniStrip P1316)
- Optimized for electroplating, wet- and dry etching
Developers
We recommend the TMAH-based, ready-to-use AZ® 2026 MIF Developer. AZ® 326 MIF and AZ® 726 MIF are possible as well.
Removers
The recommended stripper for the AZ® 125nXT-10B is the NMP-free TechniStrip P1316, in case of alkaline sensitive substrate materials use the TechniStrip P1331 or TechniStrip MLO07.
Solvents such as NMP or the untoxic substitute DMSO are suited removers, if the resist film thickness and degree of cross-linking are not too high. Generally, heating the removers up to 60 - 80°C, or/and ultrasonic treatment, might be required to fasten the resist removal in the case of very thick resist films.
Resist pattern and plated structures attained with a 60 and 120 µm thick AZ® 125nXT.
Thinning/ Edge Bead Removal
We recommend for thinning and edge bead removal the products AZ® EBR Solvent or AZ® EBR Solvent 70/30.
Further Information
MSDS:
Safety Data Sheet AZ® 125nXT-10B english
Sicherheitsdatenblatt AZ® 125nXT-10B german
TDS:
Technical Data Sheet AZ® 125nXT-10B english
Application Notes:
Further Information about Photoresist Processing
| Chemically amplified: | no |
|---|---|
| Film thickness: | 30 - 100 µm |
| Film thickness range: | thick (> 5.1µm) |
| High thermal stability: | no |
| Mode: | negative |
| Optimized for: | electroplating |
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Developer
Remover
