AZ 10XT Photoresist (220cP) - 3.785 l

AZ^® 10XT (220CPS)

Thick Resists for High Resolution

General Information

Compared to the AZ^® 4500 series, the AZ^® 10XT resists have a lower optical absorption. This simplifies the exposure of (also very) thick resist films. Therefore, in combination with the missing g-line sensitivity, the AZ^® 10XT series needs a higher exposure time under broadband condition, and reveals a lower development rate as compared to AZ^® 4500 films processed under the same conditions. On the other hand, the AZ^® 10XT shows a very high aspect ratio and resolution. For lower resist film thicknesses we recommend a dilution with PGMEA = AZ^® EBR Solvent. The following resist film thicknesses refer to 4000 rpm under standard conditions:

• 4.0 µm: 100g AZ^® 10XT + 13g PGMEA
• 3.0 µm: 100g AZ^® 10XT + 23g PGMEA
• 2.0 µm: 100g AZ^® 10XT + 42g PGMEA
• 1.5 µm: 100g AZ^® 10XT + 55g PGMEA
• 1.0 µm: 100g AZ^® 10XT + 88g PGMEA

The AZ^® 10XT is a PFOS-free alternative to the AZ^® 9260, which was discontinued in 2019. Viscosity and process parameters are identical to the former AZ^® 9260.

3.0 µm lines in 12 µm thick AZ^® 10XT Ultratech 1500 Exposure, AZ^® 400K Developer 1:4 (260s spray)  

Product Properties

• Good resist adhesion to all common substrate materials
• Compatible with all common developers (KOH- or TMAH-based)
• Compatible with all common strippers (e.g. with AZ^® 100 Remover, organic solvents or aqueous alkaline)
• h- and i-line sensitive (approx. 320 - 410 nm)
• Resist film thickness range approx. 5 - 30 µm

Developers

The recommended developers for the AZ^® 10XT photoresist are AZ^® 400K 1:4 or AZ^® 726 MIF. In case of very thick resist films, a rather strong developer concentration such as AZ^® 400K 1:3.5 - 1:3.0 might be reasonable for required short development times.

Removers

For non cross-linked resist films the AZ^® 100 Remover, DMSO or other common organic solvents can be used as stripper. If the resist film is cross-linked (e.g. by high temperature steps > 140°C, during plasma processes such as dry etching or during ion implantation), we recommend the NMP-free TechniStrip P1316 as remover. AZ^® 920 Remover can be a good choice as well, in case of harsh treated, hard to remove resist residuals.

Thinning/ Edge Bead Removal

We recommend for thinning the AZ^® EBR Solvent.

Further Information

MSDS:
Safety Data Sheet AZ^® 10XT (220cps) english
Sicherheitsdatenblatt AZ^® 10XT (220cps) german

TDS:
Technical Data Sheet AZ^® 10XT (220cps) english

Application Notes:
Further Information about Photoresist Processing