AX 100 - 5.00 l
AX 100
Activator
General Information
AX 100 is an acidic solution for activating and pretreating seed layers and metallic surfaces for electroplating, on which a direct metallization may cause problems regarding the adhesive strength. This applies e.g. for the electroplating of Au on Ni surfaces or direct electroplating on Ti or TiW layers.
AX 100 activates metallic surfaces before electroplating and allows a better adhesive strength of electroplated layers on metallic surfaces, which tend to oxidation.
Common fields of application are semiconductor fabrication and microsystem technology.
Product Properties
- Low or none etch attack on metallic surfaces
- Compatible to many materials, e.g. common metals used in electroplating industry
- Compatible to resist masking
- Not poisonous substance and easy to handle
- Moderate operation temperature of about 40°C
Selectivity
AX 100 is compatible/etches selective to following materials:
- Resists: common Novolak as masking resist (e.g. AZ® Photoresist)
- Metals: no attack on Ni, Ti, TiW, Ta, Cu
- Semiconductor materials: Si, SiO2, Si3N4
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Further Information
MSDS:
Safety Data Sheet AX 100 english
Sicherheitsdatenblatt AX 100 german
TDS:
Technical Data Sheet AX 100 english
Application Notes:
Further Information about Processing
| Resist compatible: | yes |
|---|---|
| Selectivity (no attack on): | Cu, Ni, Ta, Ti, TiW |
| Semiconductor materials: | Si, Si3N4, SiO2 |
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