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Si + dry SiO2 wafer 4 inch 525 um (100) SSP P-doped

Prime Si + SiO2 (dry) (100 nm) wafer 525 µm 100

Produktinformationen "Si + dry SiO2 wafer 4 inch 525 um (100) SSP P-doped"

Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 µm, (100), 1-side polished, n-type (Phosphor) TTV < 10 µm, 1 - 10 Ohm cm, 100 nm SiO2

Diameter (round): 4 inch
Material: Si + SiO2 (dry) (100 nm)
Orientation: 100
Quality: Prime
Resistivity: 1 - 10 Ohm cm
SiO2 thickness: 100 - 200 nm
Surface: 1-side polished
Thickness: 501 - 700 µm