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Quartz wafer 4 inch 200 um X-Cut DSP

Quartz wafer 200 µm X-Cut

Produktinformationen "Quartz wafer 4 inch 200 um X-Cut DSP"

Quartz wafer 4 inch, thickness = 200 ± 25 µm, X-Cut, 2-side polished, 1 SEMI Flat 32.5 +/-2.0 mm on X

Diameter (round): 4 inch
Material: Quartz
Orientation: X-Cut
Surface: 2-side polished
Thickness: 100 - 200 µm