Zum Hauptinhalt springen

Quartz wafer 3 inch 500 um Y-Cut DSP

Quartz wafer 500 µm Y-Cut

Produktinformationen "Quartz wafer 3 inch 500 um Y-Cut DSP"

Quartz wafer 3 inch, thickness = 500 ± 25 µm, Y-Cut, 2-side polished, TTV < 10 µm, SAW grade, Quality factor Q > 2.4M, Etch channel density ECD < 30, inclusion concentration (ID): I grade

Diameter (round): 3 inch
Material: Quartz
Orientation: Y-Cut
Surface: 2-side polished
Thickness: 401 - 500 µm