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Fused silica JGS2 wafer 4 inch 380 um DSP

Fused Silica wafer 380 µm

Produktinformationen "Fused silica JGS2 wafer 4 inch 380 um DSP"

Fused silica JGS2 wafer 4 inch, thickness = 380 ± 20 µm, 2-side polished, TTV < 10 µm