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Fused silica JGS2 wafer 3 inch 320 um DSP

Fused Silica wafer 320 µm

Produktinformationen "Fused silica JGS2 wafer 3 inch 320 um DSP"

Fused silica JGS2 wafer 3 inch, thickness = 320 ± 10 µm, 2-side polished, TTV < 10 µm