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Fused silica JGS2 wafer 2 inch 500 um DSP

Fused Silica wafer 500 µm

Produktinformationen "Fused silica JGS2 wafer 2 inch 500 um DSP"

Fused silica JGS2 wafer 2 inch, thickness = 500 ± 25 µm, 2-side polished, TTV < 10 µm, 1 flat

Diameter (round): 2 inch
Material: Fused Silica
Surface: 2-side polished
Thickness: 401 - 500 µm