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Fused silica JGS2 wafer 15 x 11,5 mm 1000 um DSP

Fused Silica wafer 1000 µm

Produktinformationen "Fused silica JGS2 wafer 15 x 11,5 mm 1000 um DSP"

Fused silica JGS2 wafer piece (15 x 11,5 mm), +0.0/-0.5 mm, thickness = 1000 ± 25 µm, 2-side polished, units of 20 pieces

Material: Fused Silica
Rectangular Size: 11 - 20 mm
Surface: 2-side polished
Thickness: 701 - 1000 µm