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Fused silica JGS1 wafer 8 inch 700 um DSP

Fused Silica wafer 700 µm

Produktinformationen "Fused silica JGS1 wafer 8 inch 700 um DSP"

Fused silica JGS1 wafer 8 inch, thickness = 700 ± 25 µm, 2-side polished, 1 SEMI Notch

Diameter (round): 8 inch
Material: Fused Silica
Surface: 2-side polished
Thickness: 501 - 700 µm