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CZ-Si wafer 4 inch 525 um (111) SSP B-doped

Prime CZ-Si wafer 525 µm 111

Produktinformationen "CZ-Si wafer 4 inch 525 um (111) SSP B-doped"

Prime CZ-Si wafer 4 inch, thickness = 525 ± 25 µm, (111), 1-side polished, p-type (Boron), TTV < 10 µm, 1 - 10 Ohm cm