Zum Hauptinhalt springen

CZ-Si wafer 4 inch 325 um (100) SSP B-doped

Prime CZ-Si wafer 325 µm 100

Produktinformationen "CZ-Si wafer 4 inch 325 um (100) SSP B-doped"

Prime CZ-Si wafer 4 inch, thickness = 325 ± 25 µm, (100), 1-side polished, p-type (Boron) TTV < 10 µm, 1 - 10 Ohm cm