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CZ-Si wafer 100 x 100 mm 625 um (100) SSP

Prime CZ-Si wafer 625 µm 100

Produktinformationen "CZ-Si wafer 100 x 100 mm 625 um (100) SSP"

Prime CZ-Si wafer piece (100 x 100 mm), thickness = 625 ± 25 µm, (100), 1-side polished, p-type (Boron), 1 - 20 Ohm cm, units of 25 wafers

Material: CZ-Si
Orientation: 100
Quality: Prime
Rectangular Size: 51 - 100 mm
Surface: 1-side polished
Thickness: 501 - 700 µm