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Borosilicate glass wafer 3 inch 500 um DSP

Borosilicate wafer 500 µm

Produktinformationen "Borosilicate glass wafer 3 inch 500 um DSP"

Borosilicate glass 3 inch glass wafer, thickness = 500 ± 25 µm, 2-side polished, primary flat 22 mm

Diameter (round): 3 inch
Material: Borosilicate
Surface: 2-side polished
Thickness: 401 - 500 µm