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Borosilicate 3 wafer inch 150 um SSP

Borosilicate wafer 150 µm

Produktinformationen "Borosilicate 3 wafer inch 150 um SSP"

Borosilicate 3 inch, thickness = 150 ± 25 µm, 1-side polished, primary flat 22 mm - only box with 50 pieces (cake Box) !

Diameter (round): 3 inch
Material: Borosilicate
Surface: 1-side polished
Thickness: 100 - 200 µm